Temporary memory (RAM)
Compatible RAM Types		-
Maximum RAM Capacity		-
Maximum Capacity per Slot		-
RAM Channel Architecture		-
Number of RAM Slots	4 DIMM slots	-
RAM Overclocking Capability	Yes	-
RAM Frequency in Overclocking Mode	3333 to 5333 MHz	-
Support for Intel XMP Profiles	Yes	-

Storage capacity

Storage capacity
Number of M.2 Slots	3 piece	-
Support for Intel Optane Memory	Yes	-

Expansion slot

Expansion slot
x1 Slot	PCIe 3.0 x1 mode support	-

Ports and features

Ports and features
Number of PS/2 Ports	No	-
Number of Rear USB Ports	10 piece	-
Number of USB Headers on Motherboard	7 piece	-
Audio Chip Type		-
Support for Digital Audio S/PDIF	No	-
D-Sub Video Port	No	-
DVI-D Video Port	No	-
Support for TPM Module	Yes	-

Connections

Connections
Number of Ethernet Ports	1 piece	-
Bluetooth Support		6.0, A2DP, LE, aptX HD, aptX Adaptive, aptX Lossless, LHDC 5
DisplayPort Port	Yes	-
Memory Card Slot	-	No

Communication ports

Communication ports
Wi-Fi Connection	Wi‑Fi 6E (802.11ax)	-

Audio features

Audio features
Number of 3.5mm Jacks	5 piece	No
Speaker Type	-	-24.8 LUFS (Very good)

Ports

Ports
HDMI Port	Yes	-

Aesthetic features

Initial data or main information

Initial data or main information
Price Range at Time of Release	-	$ 795.09 / £ 629.00
Official Release Date	-	2026, April 22
Operating System at Release	-	Android 16, up to 6 major Android upgrades, MagicOS 10
Part Numbers	-	VKP-NX9

Time and method of release

Time and method of release
Availability Status	-	Available. Released 2026, April 29

Style and design

Style and design
Front Panel Material	-	Glass front, glass back, aluminum frame
Frame material type	-	IP68/IP69K dust tight and water resistant (high pressure water jets; immersible up to 1.5m for 30 min)
Back body material	-	Glass back

Body material and design

Body material and design
Compatible SIM Card Types	-	Nano-SIM + eSIM Nano-SIM + Nano-SIM + eSIM (max 2 at a time)

Display

Display
Display Panel Type	-	AMOLED, 1B colors, 120Hz, 3840Hz PWM, HDR Vivid, 8000 nits (peak)
Screen Size	-	6.57 inches, 106.2 cm 2 (~91.2% screen-to-body ratio)
Display Resolution	-	1264 x 2728 pixels, 19.5:9 ratio (~458 ppi density)
Screen-to-Body Ratio	-	~91.2% screen-to-body ratio
Pixel Density Range	-	~458 ppi density
Maximum Brightness Level	-	1766 nits max brightness (measured)
Screen Aspect Ratio	-	19.5:9

Energy and Training

Energy and Training
Protection	-	Mohs level 4

Processor or chip

Processor or chip
Chipset Model	-	Qualcomm SM8750-AB Snapdragon 8 Elite (3 nm)
Processor Core Details	-	Octa-core (2x4.32 GHz Oryon V2 Phoenix L + 6x3.53 GHz Oryon V2 Phoenix M)
Number of Processor Cores	-	Octa-core
Chip Manufacturing Process	-	3 Nm

Central Processor (CPU)

Central Processor (CPU)
GPU Model	-	Adreno 830 (1200 MHz)

Storage memory

Storage memory
Internal Memory Capacity	-	256GB 12GB RAM, 512GB 12GB RAM, 1TB 16GB RAM
RAM Memory	-	12GB RAM, 16GB RAM

Main camera

Main camera
Maximum Video Recording Quality of Rear Camera	-	4K@30/60fps, 1080p@30/60fps, gyro-EIS, OIS
Main Camera Type - Wide/Standard	-	200 MP, f/1.9, 24mm (wide), 1/1.4", 0.56µm, PDAF (9cm - ∞), OIS
Rear Camera Details	-	Triple
Main Camera Specifications - Wide/Standard	-	200 MP, f/1.9, 24mm (wide), 1/1.4", 0.56µm, PDAF (9cm - ∞), OIS

Front camera

Front camera
Main Selfie Camera Specifications	-	50 MP, f/2.0, 21mm (wide), 1/2.88", 0.61µm
Resolution and Frame Rate of Selfie Video	-	4K@30fps, 1080p@30/60fps, gyro-EIS
Main Selfie Camera Quality	-	50 MP, f/2.0, 21mm (wide), 1/2.88", 0.61µm
Selfie Camera Video Recording Details	-	4K@30fps, 1080p@30/60fps, gyro-EIS
Maximum Video Recording Resolution of Selfie Camera	-	4K

Communications and sensors

Communications and sensors
Wi-Fi Specifications	-	Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band or tri-band, Wi-Fi Direct
Navigation Type and GPS	-	GPS, GLONASS, GALILEO, BDS, QZSS, NavIC
Wi-Fi Details and Description	-	Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band or tri-band, Wi-Fi Direct
Bluetooth Details and Description	-	6.0, A2DP, LE, aptX HD, aptX Adaptive, aptX Lossless, LHDC 5
5G Support	-	SA/NSA